A modular, independent chiplet architecture for optical I/O supporting various packaging form factors, enabling flexible adaptation to the complexity of AI interconnects.
Co-optimized design across photonics, electronics and packaging, with the consideration of system level balance among performance, energy efficiency, and complexity.
Semiconductor packaging process technologies for optical systems, enabling mass production, reliability, and long-term technology evolution.
Designed to deliver scalable bandwidth, low interconnect power consumption, and reliable operation, to support AI systems at scale and complexity.
