1.6T+ Optical Transceivers (DPO/LPO/LRO)-Application-PhotonicX AI Pte. Ltd.

High-Density Optical Interconnects for AI Clusters

Scale-out networks expand AI computing capacity by interconnecting a growing number of compute nodes across clusters.

As port counts and data rates increase, optical interconnect density, power efficiency, and system reliability become critical design constraints.

Key Industry Challenges

Density, Power, and Reliability at Cluster Scale

Rapid growth in port density and cabling complexity

Rising system power consumption and operatiing cost

Reliability and consistency challenges in large-scale deployments

Electrical Interconnect

Gbps/Watt

Pluggable Optical Modules

Gbps/Watt

Optical I/O Chiplets

Gbps/Watt

PhotonicX AI's Approach

PhotonicX AI focuses on high-density optoelectronic integration and scalable optical I/O architectures to reduce

per-port power,simplify system integration, and improve reliability in large AI clusters.

Optical I/O Moved Closer to the Compute Core

By bringing optical interconnect capabilities closer to the compute core, electrical path length is significantly reduced, overcoming bandwidth and distance limitations of traditional electrical interconnects.

High-Density Optoelectronic Integration

High-density optoelectronic integration enables scalable, low-latency GPU interconnects while reducing system-level power consumption and thermal pressure in AI supernodes.

Polymorphic Architecture Adaptation

A chiplet-based optical I/O architecture supports multiple packaging and system configurations, enabling flexible adaptation to diverse AI supernode designs.