AI systems are scaling beyond single-chip performance
AI training and inference are evolving toward large-scale, tightly coupled systems, where overall performance is increasingly determined by interconnect bandwidth, latency, and energy efficiency.
Electrical interconnects are reaching physical limits
Traditional electrical interconnects face fundamental limitations in bandwidth, reach, power consumption, and thermal scalability, making them difficult to sustain GPU-to-GPU scaling.
Optical I/O is emerging as a key enabler — but form factor matters
Optical I/O is emerging as a critical path to overcome interconnect bottlenecks. However, fixed form-factor optical solutions struggle to adapt to diverse computing architectures and packaging requirements.
Future AI interconnects require architectural flexibility
To support scalable AI systems, optical interconnects must evolve toward more modular, architecture-aware, and packaging-flexible implementations.
