Scale-out Network|High-Density Optical Interconnect
High-Density Optical Interconnects for AI Clusters

Scale-out networks expand AI computing capacity by interconnecting a growing number of compute nodes across clusters.


As port counts and data rates increase, optical interconnect density, power efficiency, and system reliability become critical design constraints.

Key Industry Challenges
Density, Power, and Reliability at Cluster Scale
Rapid growth in port density and cabling complexity
Rising system power consumption and operatiing cost
Reliability and consistency challenges in large-scale deployments
Electrical Interconnect
Not feasible
Pluggable Optical Modules
Bandwidth density ~15 Gb/s/mm
Optical I/O Chiplets
Bandwidth density > 400Gb/s/mm
Key Industry Challenges
PhotonicX AI's Approach

PhotonicX AI focuses on high-density optoelectronic integration and scalable optical I/O  architectures to reduce

 per-port power,simplify system integration, and improve reliability in large AI clusters.

Linear Drive TROSA
Linear Drive Transmitter Receiver Optical Sub-Assembly (TROSA) to support high-density FRO (Fully Retimed Optics), LPO (Linear Pluggable Optics) and LRO (Linear Receiver Optics) transceivers.
High-Density Optoelectronic Integration
High-density optoelectronic integration enables scalable, low-latency GPU interconnects while reducing system-level power consumption and thermal pressure in AI supernodes.
Various Architecture Adaptation
A chiplet-based optical I/O architecture supports multiple packaging and system configurations, enabling flexible adaptation to diverse AI supernode designs.
Related Products
Optical I/O Chiplets (NPO/CPO/XPO)
Optical I/O Chiplets (NPO/CPO/XPO)
A chiplet-based optical I/O solution delivering high bandwidth density, low latency, and low power comsumption optical interconnects for AI computing.
Chiplet-based optical I/O
Multiple packaging support (NPO/CPO/XPO)
High bandwidth density, low latency, and low power consumption
Learn More
High-Speed Silicon Photonics Chips
High-Speed Silicon Photonics Chips
High-speed silicon photonics chips for next-generation optical transceivers, enabling efficient electro-optic and opto-electronic conversion with high bandwidth, high linearity, and high integration for 1.6T and beyond.
High integration
Large bandwidth
High linearity
Learn More
High-Speed Electrical ICs (Driver/TIA)
High-Speed Electrical ICs (Driver/TIA)
High-speed electrical Ics, including Drivers and TIAs, designed to ensure signal integrity and energy efficiency for 1.6T optical transceivers and beyond.
High-performance Driver & TIA
Signal integrity optimization
Energy-efficient analog design
Learn More
Defining the Future of AI Optical Interconnects
Design GPU-GPU optical interconnects for AI supernodes.
Work directly with PhotonicX AI’s technical experts.
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