Optical I/O Chiplets (NPO/CPO/XPO)-Optical I/O Chiplets-PhotonicX AI Pte. Ltd.

Optical I/O Chiplets

A chiplet-based optical I/O solution delivering high bandwidth density, low latency, and low power comsumption optical interconnects for AI computing.

Chiplet-based optical I/O

Multiple packaging support (NPO/CPO/XPO)

High bandwidth density, low latency, and low power consumption

Optical I/O

Chiplet

Scale-up Interconnect

CPO

NPO

Key Features

Independent, flexible optical interconnect capabilities delivered at the chiplet level.

Chiplet-based optical I/O

Delivers optical I/O as independent chiplets for flexible and scalable system integration.

Multiple packaging support (NPO/CPO/XPO)

Supports multiple packaging and integration options, allowing optical I/O to be deployed across different AI system architectures.

High bandwidth density, low latency, and low power consumption

Achieves higher bandwidth density while reducing interconnect latency and power consumption, improving overall AI system efficiency.

Applications

Enabling optical interconnects across scale-up and scale-out networks in AI computing clusters.

Scale-up networks(Super-nodes)

Enables long-reach, high-bandwidth, and low-latency GPU-to-GPU optical interconnects to eliminate interconnect bottleneck for AI supernodes.

High-bandwidth and high-density scale-out networks

Supports high-density optical interconnects for large-scale AI clusters with improved efficiency and reliability.

PhotonicX Al

To make sustainable optical interconnects to keep up with fast growing AI demands.

A scalable architecture for next-generation AI interconnects.

PhotonicX AI is built on an independent Optical I/O architecture with system-level co-design, enabling scalable bandwidth growth, improved interconnect efficiency, and flexible integration for AI systems.