Scale-up Networks｜GPU–GPU Optical Interconnects-Application-PhotonicX AI Pte. Ltd.

Optical Interconnects for AI Supernodes

As AI model training and inference continue to scale, overall system performance is increasingly determined by the reach, bandwidth, latency, and energy efficiency of GPU-to-GPU interconnects.

Optical interconnects in scale-up networks expand GPU interconnect scale through long-reach, high-bandwidth, low-latency optical technologies to form large-size AI supernodes, becoming a critical technology for high-performance AI computing.

Key Industry Challenges

When Compute Scales Faster Than Interconnects

Electrical interconnects approach physical limits in bandwidth and reach

Latency and communication overhead increase rapidly as GPU count scales

Power and thermal constraints intensify at the system level

Electrical Interconnect

Limited by reach and power consumption

Pluggable Optical Modules

Limited by size, power consumption and latency

Optical I/O Chiplets

Enabling high-density, energy-efficient scale-up

PhotonicX AI's Approach

To address system-level challenges in scale-up networks, PhotonicX AI uses a chiplet-based optical I/O

architecture to significantly increase GPU-to-GPU interconnect efficiency.

Optical I/O Moved Closer to the Compute Core

By bringing optical interconnect capabilities closer to the compute core, electrical path length is significantly reduced, overcoming bandwidth and distance limitations of traditional electrical interconnects.

High-Density Optoelectronic Integration

High-density optoelectronic integration enables scalable, low-latency GPU interconnects while reducing system-level power consumption and thermal pressure in AI supernodes.

Various Architecture Adaptation

A chiplet-based optical I/O architecture supports multiple packaging and system configurations, enabling flexible adaptation to diverse AI supernode designs.

Related Products

Optical I/O Chiplets (NPO/CPO/XPO)

A chiplet-based optical I/O solution delivering high bandwidth density, low latency, and low power comsumption optical interconnects for AI computing.

Chiplet-based optical I/O

Multiple packaging support (NPO/CPO/XPO)

High bandwidth density, low latency, and low power consumption

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Defining the Future of AI Optical Interconnects

Design GPU-GPU optical interconnects for AI supernodes.
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