High-Speed Silicon Photonics Chips-High-Speed Optoelectronic Chips-PhotonicX AI Pte. Ltd.

High-Speed Silicon Photonics Chips

High-speed silicon photonics chips for next-generation optical transceivers, enabling efficient electro-optic and opto-electronic conversion with high bandwidth, high linearity, and high integration for 1.6T and beyond.

High integration

Large bandwidth

High linearity

Key Features

Built to support next-generation optical transceivers by balancing bandwidth, linearity, and integration in silicon photonics devices.

High integration

Integrates multiple photonic functions on a compact silicon platform, supporting high-density and compact optical transceiver designs.

Large bandwidth

Designed for ultra-high-speed optical links, supporting 1.6T and beyond data rates.

High linearity

Optimized for linear optical architectures, improving link performance and system margin.

Applications

Targeted at 1.6T+ optical transceivers, supporting both DSP-based and linear architectures.

1.6T+ Optical Transceivers (DPO / LPO / LRO)

Enables high-performance modulation and detection for next-generation pluggable and linear optical transceivers.

PhotonicX Al

To make sustainable optical interconnects to keep up with fast growing AI demands.

A scalable architecture for next-generation AI interconnects.

PhotonicX AI is built on an independent Optical I/O architecture with system-level co-design, enabling scalable bandwidth growth, improved interconnect efficiency, and flexible integration for AI systems.