Optical I/O Chiplets-Optical I/O Chiplets-PhotonicX AI Pte. Ltd.

Optical I/O Chiplets

An Optical I/O chiplet with various form factors including NPO, CPO and XPO, for high-bandwidth-density, low-latency and low-power-consumption AI interconnects.

Chiplet-based optical I/O

Various form factors

High bandwidth density, Low power consumption and low latency

Optical I/O

Chiplet

Scale-up Interconnect

CPO

NPO

Key Features

Independent, flexible optical interconnect capabilities delivered at the chiplet level.

Chiplet-Based Optical I/O

Delivers optical I/O as independent chiplets for flexible and scalable system integration.

Multiple packaging support (NPO / CPO / XPO)

Supports multiple packaging and integration options, allowing optical I/O to be deployed across different AI system architectures.

High bandwidth density, low latency, and low power consumption

Achieves high bandwidth density while reducing interconnect latency and power consumption, improving overall AI system efficiency.

Applications

Enabling optical interconnects across scale-up and scale-out networks in AI computing clusters.

Scale-Up Networks (Super-Nodes)

Enables high-bandwidth, low-latency GPU-to-GPU optical interconnects to support tightly coupled AI supernodes.

High-Bandwidth and High-Density Scale-Out Networks

Enables high-bandwidth, low-latency GPU-to-GPU optical interconnects to support tightly coupled AI supernodes.

PhotonX AI

Designed using a chiplet-based Optical I/O architecture and system-level co-design approach to support scalable
AI interconnects.

Independent Optical I/O Chiplet Architecture

Designed using a chiplet-based Optical I/O architecture and system-level co-design approach to support scalable AI interconnects.